Express Newsletter: solder and balls and 0.13 (Page 8 of 99)

SMTnet Express - August 26, 2021

SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding

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SMTnet Express June 13 - 2013, Subscribers: 26140

SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging

SMTnet Express - June 2, 2016

SMTnet Express, June 2, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D


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